ATP RAM DDR3

Key Features ATP-Built, Characterized and Tested from IC to Module 100% test during burn-in (TDBI) Available in monolithic 8 Gb one-chip select (1CS) Available in 8 Gb DDP two-chip select (2CS) Longevity Support Available DDR3 Configurations A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package. Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip as two components despite being in the same package. ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of memory modules based on this technology. With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements to maximize customers’ infrastructure investments.